Tan, Cher Ming books & textbook
Electromigration Modeling at Circuit Layout Level (SpringerBriefs in Applied Sciences and Technology)
Springer /2013-05-04 Paperback / 112 Pages
isbn-10: 9814451207 / isbn-13: 9789814451208
Electromigration In Ulsi Interconnections (International Series on Advances in Solid State Electronics and Technology)
Wspc /2010-06-25 Hardcover / 312 Pages
isbn-10: 9814273325 / isbn-13: 9789814273329
Graphene and VLSI Interconnects
Tan, Cher-Ming Narula, Udit Sangwan, Vivek
Jenny Stanford Publishing /2021-11-25 Hardcover / 116 Pages
isbn-10: 9814877824 / isbn-13: 9789814877824
Future Learning in Primary Schools: A Singapore Perspective
Chai, Ching Sing Lim, Cher Ping Tan, Chun Ming
Springer /2015-10-19 Hardcover / 225 Pages
isbn-10: 9812875786 / isbn-13: 9789812875785
Theory and Practice of Quality and Reliability Engineering in Asia Industry
Tan, Cher Ming Goh, Thong Ngee
Springer /2018-07-14 Paperback / 313 Pages
isbn-10: 9811098344 / isbn-13: 9789811098345
Simulated Annealing
Intechopen /2008-09-01 Hardcover / 430 Pages
isbn-10: 9537619079 / isbn-13: 9789537619077
Reliability Analysis of Electrotechnical Devices
Mdpi AG /2022-07-20 Hardcover / 174 Pages
isbn-10: 3036546537 / isbn-13: 9783036546537
Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections (Springer Series in Reliability Engineering)
Tan, Cher Ming Li, Wei Gan, Zhenghao Hou, Yuejin
Springer /2013-04-21 Paperback / 160 Pages
isbn-10: 1447126416 / isbn-13: 9781447126416
Reliability and Failure Analysis of High-Power LED Packaging (Woodhead Publishing Series in Electronic and Optical Materials)
Tan, Cher Ming Singh, Preetpal
Woodhead Publishing /2022-10-12 Paperback / 188 Pages
isbn-10: 0128224088 / isbn-13: 9780128224083
Microelectronic Yield, Reliability, and Advanced Packaging (Proceedings of Spie)
Tan, Cher Ming Peng, Yeng-kaung Mahalingam, Mali Prasad, Krishnamachar
Society of Photo Optical / Paperback / 240 Pages
isbn-10: 0819439010 / isbn-13: 9780819439017
