ISBN 9811201110 books & textbook
Encyclopedia of Packaging Materials, Processes, and Mechanics - Set 1: Die-Attach and Wafer Bonding Technology (a 4-Volume Set)
Bar-Cohen, Avram Suhling, Jeffrey C Tay, Andrew A O
World Scientific Publishing Company /2019-10-18 Hardcover / 1080 Pages
isbn-10: 9811201110 / isbn-13: 9789811201110
