ISBN 9783642061158 books & textbook
Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales
Luo, Jianfeng Dornfeld, David A.
Springer /2010-12-15 Paperback / 335 Pages
isbn-10: 364206115X / isbn-13: 9783642061158
