Tu, King Ning books & textbook
Electronic Thin Film Science for Electrical Engineering and Materials Scientists
Tu, King-Ning Mayer, James W. Feldman, Leonard C.
Macmillan /1996-12-02 Hardcover
isbn-10: 0024215759 / isbn-13: 9780024215758
Kinetics in Nanoscale Materials
Tu, King-Ning Gusak, Andriy M.
Wiley /2014-05-27 Hardcover / 312 Pages
isbn-10: 0470881402 / isbn-13: 9780470881408
Electronic Thin-Film Reliability
Cambridge University Press /2011-01-17 Hardcover / 412 Pages
isbn-10: 0521516137 / isbn-13: 9780521516136
Understanding the Reliability Technology Based on Entropy Production, and Other Researches
Independently published /2021-05-15 Paperback / 130 Pages
Silicon and Silicide Nanowires: Applications, Fabrication, and Properties
Jenny Stanford Publishing /2013-10-24 Hardcover / 484 Pages
isbn-10: 9814303461 / isbn-13: 9789814303460
Advanced Interconnects and Contacts: Volume 564 (MRS Proceedings)
Edelstein, Daniel C. Kikkawa, Takamaro Öztürk, Mehmet C. Tu, King-Ning Weitzman, Elizabeth J.
Cambridge University Press /1999-10-07 Hardcover / 577 Pages
isbn-10: 1558994718 / isbn-13: 9781558994713
Electronic Packaging Materials Science VIII: Volume 390 (MRS Proceedings)
Børgesen, Peter Jackson, Kenneth A. Sundahl, Robert C. Tu, King-Ning
Materials Research Society /1995-09-26 Hardcover / 284 Pages
isbn-10: 1558992936 / isbn-13: 9781558992931
Solder Joint Technology: Materials, Properties, and Reliability (Springer Series in Materials Science, 92)
Springer /2010-11-19 Paperback / 386 Pages
isbn-10: 1441922849 / isbn-13: 9781441922847
Electronic Packaging Science and Technology
Tu, King-Ning Chen, Chih Chen, Hung-Ming
Wiley /2021-12-29 Hardcover / 336 Pages
isbn-10: 1119418313 / isbn-13: 9781119418313
Elements of Electromigration: Electromigration in 3D IC technology
CRC Press /2024-01-19 Hardcover / 132 Pages
isbn-10: 1032470275 / isbn-13: 9781032470276
