Lau, John H. books & textbook
Semiconductor Advanced Packaging
Springer /2021-05-18 Hardcover / 520 Pages
isbn-10: 9811613753 / isbn-13: 9789811613753
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Springer /2024-05-24 Hardcover / 521 Pages
isbn-10: 9819721393 / isbn-13: 9789819721399
Voices of Varuna: A Renegade Legion Universe Anthology
Rome, Ben H. Harris, Carrie Lau, Wunji McDermott, Will Peel, John Rabe, Jean Rockwell, Marsheila Seto, K. T. Stegall, Sarah Vincent, Bev
Budgie Smuggler Games /2021-06-14 Paperback / 279 Pages
isbn-10: 1736141414 / isbn-13: 9781736141410
3D IC Integration and Packaging
McGraw Hill /2015-08-27 Hardcover / 480 Pages
isbn-10: 0071848061 / isbn-13: 9780071848060
Chip Scale Package: Design, Materials, Process, Reliability, and Applications
Lau, John H. Lee, Ricky S.W. Lee, S.W. Ricky
McGraw-Hill Professional /1999-02-28 Hardcover / 564 Pages
isbn-10: 0070383049 / isbn-13: 9780070383043
Solder Joint Reliability: Theory and Applications
Van Nostrand Reinhold /1991-05-31 Hardcover / 652 Pages
isbn-10: 0442002602 / isbn-13: 9780442002602
Chiplet Design and Heterogeneous Integration Packaging
Springer /2024-03-29 Paperback / 547 Pages
isbn-10: 9811999198 / isbn-13: 9789811999192
Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
Springer /1994-06-30 Hardcover / 576 Pages
isbn-10: 0442014414 / isbn-13: 9780442014414
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
McGraw-Hill Professional /2000-02-08 Hardcover / 585 Pages
isbn-10: 0071351418 / isbn-13: 9780071351416
Through-Silicon Vias for 3D Integration
McGraw Hill /2012-10-11 Hardcover / 512 Pages
isbn-10: 0071785140 / isbn-13: 9780071785143
