Keser, Beth books & textbook
Advances in Embedded and Fan-Out Wafer Level Packaging Technologies (IEEE Press)
Wiley-IEEE Press /2019-02-12 Hardcover / 576 Pages
isbn-10: 1119314135 / isbn-13: 9781119314134
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package (IEEE Press)
Wiley-IEEE Press /2021-12-29 Hardcover / 320 Pages
isbn-10: 1119793777 / isbn-13: 9781119793779
