ISBN 0070383049 books & textbook
Chip Scale Package: Design, Materials, Process, Reliability, and Applications
Lau, John H. Lee, Ricky S.W. Lee, S.W. Ricky
McGraw-Hill Professional /1999-02-28 Hardcover / 564 Pages
isbn-10: 0070383049 / isbn-13: 9780070383043
